Request for FCBGA-1364 Detailed Footprint Dimension

lguancho — Wed, 19 Jun 2024 09:02:48 GMT

Hi. I need to do BGA reballing for an Intel Embedded Flip Chip BGA with 1364 ball. The size of the BGA is 37.5 x 32.0 x 1.6 mm.

The Intel Part Number is SR1W0 (Intel Core I7 Mobile I7-4702EC)

In order to fabricate the stainless steel reballing stencil, I need the detailed CAD footprint for the part. The short form 1 page mechanical drawing I can find from open source does not have much details.

Appreciate if Intel support group could email me the relevant details

Thanks

lguancho

Re: Request for FCBGA-1364 Detailed Footprint Dimension

CarlosAM_INTEL — Wed, 19 Jun 2024 16:26:53 GMT

Hello, @lguancho:

Thank you for contacting Intel Embedded Community.

The Intel® Core™ i7-4702EC is a Haswell Processor that has been discontinued and is no longer supported, as is stated in the Specifications section, specifically in the Supplemental Information subsection of the following website:

https://www.intel.com/content/www/us/en/products/sku/75556/intel-core-i74702ec-processor-8m-cache-up-to-2-00-ghz/specifications.html

We need to clarify that the Haswell processor family has been discontinued and is no longer supported, as you may verify on the following website:

https://www.intel.com/content/www/us/en/support/articles/000022396/processors.html

However, you may find the available documentation for the Haswell processors that may help you on the following websites:

https://www.intel.com/content/www/us/en/products/platforms/details/haswell-e.html

https://www.intel.com/content/www/us/en/products/platforms/details/haswell-dt-refresh.html

Best regards,

@CarlosAM_INTEL.

topic Request for FCBGA-1364 Detailed Footprint Dimension in Embedded Intel® Core™ Processors

Request for FCBGA-1364 Detailed Footprint Dimension

Re: Request for FCBGA-1364 Detailed Footprint Dimension