i7-5850eq thermal design

[aatıc]

Hi everyone,

I am trying to design a cooling solution for i7-5850eq processor. But I could not find some parameters that are needed.

I need the below info for a proper design.

Rjc (Junction to case thermal resistance)

RJB (Junction to board thermal resistance)

I could not find any info about the subject on the documentation page (https://www-ssl.intel.com/content/www/us/en/embedded/products/broadwell-h/documentation.html 5th Generation Intel® Core™ Processors: Documentation ).

Has anybody faced this problem before? Or do you have any other solutions?

Best Regards,

[CarlosAM_INTEL · Accepted solution]

Hello alicanatici,

Thank you for contacting the Intel Embedded Community.

The information that may help you is stated in the third column of the Table stated on page 6, also the information stated on pages 11 and 12 of the http://www.intel.com/content/dam/www/public/us/en/documents/guides/5th-gen-core-mobile-embedded-thermal-mech-guide.pdf 5th Generation Intel(R) Core(TM) Processor Family Mobile Thermal Mechanical Design Guide for Embedded Applications document # 331829.

We hope that this information may help you.

Best Regards,

Carlos_A.

[aatıc]

Hello Carlos,

This would definitly help. Thanks.

Best Regards,

[CarlosAM_INTEL]

Hello alicanatici,

Thanks for your reply.

We are glad that our suggestions were useful to you.

Please do not hesitate to contact us again if you have more questions related to Intel Embedded products.

Best Regards,

Carlos_A.