关于部分至强E5-2648 散热壳体和GND阻抗偏低的问题？

[任杰]

我司产品出现由于部分E5-2648 散热金属壳体和GND阻抗偏低（机箱地通过散热器、CPU固定支架、CPU金属散热壳体接触），而导致机箱地和信号地阻抗较低只有10欧姆左右，存在安全隐患。请问这些散热壳体和信号地阻抗较低的CPU，是产品工艺导致的吗？怎样去规避这一问题？这些CPU是否属于不良品？

[CarlosAM_INTEL]

Hello, @任杰​:

Thank you for contacting Intel Embedded Community.

The support provided through this channel is only in English language.

 However, we suggest verify that your implementation follow the guidelines stated in the Intel® Xeon® Processor E5-2600 v4 Product Family: Thermal Mechanical Specification and Design Guidelines document# 333812. This document can be found when you are logged into your Resource & Design Center (RDC) privileged account at the following website:

http://www.intel.com/cd/edesign/library/asmo-na/eng/568130.htm

The RDC Account Support form is the channel to process your account update request or any inconvenience related to the provided websites. It can be found at:

https://www.intel.com/content/www/us/en/forms/support/my-intel-sign-on-support.html

Best regards, 

@Mæcenas_INTEL​.