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Does the Flip Chip BGA Device package is vented or not vented?

Tataria
Beginner
549 Views

Hello,

I am using following parts.

Source MPN Supplier Package
10M08SAM153I7G MBGA
FH8065301989700-SR3V3 FCBGA
GG8067402570801-SR2M5 FCBGA
GG8067402569000SR2DH FCBGA

Some Manufacturer have, vent on the Flip Chip BGA Device package.

Some BGA packages are not hermetically sealed, and exposure to cleaning solvents or excessive moisture during board assembly can pose serious package reliability concerns. Small vents are placed by design between the heatspreader (lid) and the organic substrate to allow for outgassing and moisture evaporation.

So I like to know if all these above parts are vented or not vented?

Thank you so much for your time.

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Adolfo_S_Intel
Moderator
440 Views

Hello @Tataria 

 

We send you an e-mail with the best approach about how to find this information.

 

Best Regards,

@Adolfo_S_Intel 

 

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