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Hello,
I am using following parts.
Source MPN | Supplier Package |
10M08SAM153I7G | MBGA |
FH8065301989700-SR3V3 | FCBGA |
GG8067402570801-SR2M5 | FCBGA |
GG8067402569000SR2DH | FCBGA |
Some Manufacturer have, vent on the Flip Chip BGA Device package.
Some BGA packages are not hermetically sealed, and exposure to cleaning solvents or excessive moisture during board assembly can pose serious package reliability concerns. Small vents are placed by design between the heatspreader (lid) and the organic substrate to allow for outgassing and moisture evaporation.
So I like to know if all these above parts are vented or not vented?
Thank you so much for your time.
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Hello @Tataria
We send you an e-mail with the best approach about how to find this information.
Best Regards,

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