Hello, everyone:
I'd like to consult about a problem. Among more than 100 boards we produced in the past two years that use the 82599 10 GbE Controller, approximately 7 boards have sporadically experienced the frequent "link up/down" phenomenon of the 82599 10 GbE Controller. Among them, the problem of 2 boards only emerged after the customers had used them for over a year.
After our investigation, we found that using a heat sink would lead to this phenomenon. When the heat sink is removed, the situation returns to normal. And this fault phenomenon is only related to the metallic material of the heat sink-like object. Contacting or pressing with insulating objects will not cause this fault.
We tried to stick insulating tape around the heat sink, leaving only the wafer part in the middle of the chip exposed. However, the fault still occurs after installing the heat sink in this way.
Questions:
1. Have any official engineers or other engineers encountered a similar problem? If so, what is the cause of this problem?
2. Does the official side have any tools for adjusting parameters such as pre-emphasis?
3. Does the official side have any manuals or guidelines for sending test patterns? We want to check the eye diagram.
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中文：
大家好：
请教一个问题，我们在近2年生产的100多块使用82599 10 GbE Controller的板卡中，前后偶发出现约7块板卡的82599 10 GbE Controller频繁出现link up/down现象，其中2块是在客户使用1年多的时间后才暴露的。
经过我们排查，发现使用散热器会导致此现象发生，当拆除散热器后恢复正常，而这一故障现象只与类似散热器的金属材质有关，绝缘物体接触或按压均不会导致此故障。
我们尝试使用绝缘胶带将散热器周围粘贴住，只有芯片中间晶圆部分裸露，这样安装散热器后故障还是会发生。
疑问：
1、是否有官方或其他工程师遇到过类似问题？如果是，这是什么原因导致的？
2、官方是否有调整预加重之类参数的工具？
3、官方是否有发送测试码型的手册或者指导？我们看下眼图。
Link Copied
Hi Pujeeth：
1)The Driver version：
2)The Firmware version：
3)Operating system：
4)Operating temperature is 30℃.
5)We designed 82599 on the board, and the power supply is also designed on the board. The following is the design block diagram of the 82599 part.
Regards
