I210-CL happens crack after thermal shock 250 cycles.

[TSUNG-YI]

Issue description:

• During thermal shock qualification of the Ampere low CTE substrate CPUs, the host primary compute boards showed functional failures associated with with the I210CL PICe NIC (100% FR). Thermal shock was done at -40°C/85°C air-to-air.
• Found first the issue in test cycles: 250.
• Board version : DV1

We need support for this issue.

1. Please provide final footprint recommand drawing, not only package drawing.

2. we did not add 4-corner PADs for IC footprint, we will do it and fab PCB, and then new PCBA will run thermal shock testing again. if the result still fail, we need Intel support to resovle this issue.

3. Does Intel have the report of I210CL IC side thermal shock testing?

[Vik3]

Hello TSUNG-YI,

Thank you for posting in the Intel Community. We sincerely apologize for the delay in our response. We have received your concern and would like to assure you that assisting you is our top priority.

Could you kindly let us know if the issue has been resolved, or if you require further assistance from us? Your prompt response will greatly help us in diagnosing and resolving the issue as quickly as possible.

We appreciate your patience and understanding, and we look forward to hearing from you soon.

Regards,

Vikas

Intel Customer Support Technician

[Vik3]

Hello TSUNG-YI,

Thank you for posting in the Intel Community.

This is the follow-up regarding the issue you reported to us.

We request to please let us know if the issue has been resolved, or if you require further assistance from us?

We await your response to assist you further.

Thank you for using Intel products and services.

Best regards,  

Vikas  

Intel Customer Support Technician

[Subhashish]

Hello TSUNG-YI,

Greetings !!

We have not heard back from you. We hope your issue is now resolved. Should you require any further assistance, please feel free to write back to us. As of now, we are proceeding to close this case.

Regards,

Subhashish_Intel.