I am looking for thermal information for component 5CEFA7F23I7N, specifically any and all thermal resistances for the package to assess thermal performance in our application. The datasheet states a maximum operating junction temperature, but does not appear to state the thermal junction to case or junction to board thermal resistance values required for mechanical thermal analyses.
Early Power Estimator(EPE) spreadsheet has calculation on power thermal generated from each design on Cyclone V and you can decide how you need to dissipate the thermal based on the calculation.
EPE can be downloaded from this link: https://www.intel.com/content/www/us/en/support/programmable/support-resources/power/cy4-5-estimator...
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