I am looking for thermal information for component 5CEFA7F23I7N, specifically any and all thermal resistances for the package to assess thermal performance in our application. The datasheet states a maximum operating junction temperature, but does not appear to state the thermal junction to case or junction to board thermal resistance values required for mechanical thermal analyses.
Early Power Estimator(EPE) spreadsheet has calculation on power thermal generated from each design on Cyclone V and you can decide how you need to dissipate the thermal based on the calculation.
EPE can be downloaded from this link: https://www.intel.com/content/www/us/en/support/programmable/support-resources/power/cy4-5-estimator-download.html
We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.