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BGA ball composition and melting point for MPN: 5M160ZM100C5N

spong1303
Beginner
184 Views

As below information is unable found in the datasheet, pls help to check & provide BGA ball composition and melting point for MPN: 5M160ZM100C5N.

 

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1 Solution
AqidAyman_Intel
Employee
162 Views

Hi Supeng,


Thank you for reaching out to Intel FPGA Community.


For your request, I need to check with the respective team. I will provide the information once I received it as soon as possible.


Regards,

Aqid Ayman


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3 Replies
AqidAyman_Intel
Employee
163 Views

Hi Supeng,


Thank you for reaching out to Intel FPGA Community.


For your request, I need to check with the respective team. I will provide the information once I received it as soon as possible.


Regards,

Aqid Ayman


AqidAyman_Intel
Employee
154 Views

Hi Supeng,


The BGA ball composition for MAX V CPLD is Sn:Ag:Cu = 96.5:3.0:0.5.

The melting point of SAC305 solder ball is 217'C.


Regards,

Aqid Ayman


AqidAyman_Intel
Employee
131 Views

We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread.

 

Thank you.

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