FPGA, SoC, And CPLD Boards And Kits
FPGA Evaluation and Development Kits

Bent Leads P/N EPF6016QI208

MDingel
Beginner
413 Views

Hello,  

Our customer informed us at incoming inspection they found bent leads on 3 out of 5 parts. P/N EPF6016QI208-3.  Parts were not un-packed/re-packed at our warehouse.

Please advise how to proceed, is a FA required?

Thanks!

Melanie

 

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1 Solution
NurAiman_M_Intel
Employee
320 Views

Hi,


Please inform customer,


Further checking with my team, EPF6016QI208-3 was obsolete since 2017, last shipment was on 2017. Please refer to PDN 1619.

Hence sorry to tell you that we are unable to support this request as FLEX 6000 was EOL since 2017 and we do not have enough resource to support this request.


For your information, all our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units . Intel FPGA Reliability Report had stated clearly that Intel performs comprehensive testing and manufacturing controls on all its products. There is a high possibility that it was damaged in transit or shipping or improper storage. We are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no FA will be proceeded for this case.


Regards,

Aiman


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3 Replies
NurAiman_M_Intel
Employee
400 Views

Hi,


Please open an IPS case as you have the access to IPS.


Thank you.


Regards,

Aiman


MDingel
Beginner
354 Views

Hello Aiman,

When trying to submit a case, it stated I do not have access to IPS.  Can you please advise directions on how to get access?

NurAiman_M_Intel
Employee
321 Views

Hi,


Please inform customer,


Further checking with my team, EPF6016QI208-3 was obsolete since 2017, last shipment was on 2017. Please refer to PDN 1619.

Hence sorry to tell you that we are unable to support this request as FLEX 6000 was EOL since 2017 and we do not have enough resource to support this request.


For your information, all our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units . Intel FPGA Reliability Report had stated clearly that Intel performs comprehensive testing and manufacturing controls on all its products. There is a high possibility that it was damaged in transit or shipping or improper storage. We are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no FA will be proceeded for this case.


Regards,

Aiman


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