I have a meeting with the TerASIC this morning. The TerASIC RDtold me that the Cyclone 10 has the overheat issue. It have to mount a fan on the FPGA otherwise it will crash.
The problem is we are going to put the FPGA board in a water sealed box. There is no free air flow will go into the box. Is that overheat issue real for Cyclone 10 GX? We choose the 10CX220.
Did you try to run the EPE (Early Power Estimation) and is the tool suggested to apply heatsink or fan to cool down the Cyclone 10 device from its calculation?
As we have not heard from you for a while, this Case is idling. It is not recommended to idle for too long. Therefore following our support policy, I have to put this case in close status. My apologies if any inconvenience caused. Hence, This thread will be transitioned to community support.
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