We are using Cyclone10(10CL040) and regulator(EZ6361QI) in one of our design.For thermal simulation following information is required-
1. Material of the device
3. Specific heat
4. Melting temperature
6. Thermal conductivity
Could you please share these information's for both the device to us so
that we proceed to the design.
Thank you for contacting Intel Community.
Here is some of the answer for Cyclone 10:
- Material of the device can be obtain from the website given:
3.Specific heat can be obtain from below website:https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/thermal.html?type=thermal&family=Cyclone_10
For question 2, 4, 5, and 6, we will need more info on it. Are you designing PCB stackup, heatsink, or anything? Hope you can be more specify so we can help you with the right solution.
Regarding regulator, i need to clarify is it EN6361 OR EZ6301 since we don't have part number EZ6361?
Here are some answers for EZ6301QI:
1 -Material of the device can be obtained from the website: https://www.intel.com/content/www/us/en/programmable/support/quality-and-reliability/environmental/material-decl.html
3 -Thermal characteristics can be obtained from the product datasheet : https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/ds/ez6301qi_13926.pdf
For questions 2, 4, 5, and 6, we will need more info on it. Are you designing PCB stackup, heatsink, or anything? Hope you can be more specify so we can help you with the right solution.
Since there's no update on this case, i will set this case to close. Hope you are doing well with the device. Feel free to post a new case if needed. Thank you.