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Delidding FPGA

BD28
Beginner
545 Views

Currently, I am attempting to perform an DPA on the the Intel Altera Aria 10 GX FPGA. I have ran into an issue during the delidding process, which is the thermal expoxy cauisng a strong bond between the heatspreader and board. I am seeking information to delidd the component without damaging internal components, is there a process that exists or person that can be contacted?

0 Kudos
8 Replies
NurAiman_M_Intel
Employee
526 Views

Hi,


I am checking this with my internal team. Will be back for further information.


Regards,

Aiman


BD28
Beginner
513 Views

Aiman,

Has your team provided any additional information?

 

BD

NurAiman_M_Intel
Employee
496 Views

Hi,


May I know why you need to do the delidding process?


Regards,

Aiman


NurAiman_M_Intel
Employee
491 Views

Hi,


Additional question, please explain what is DPA and why do you need to do it? Please note that once the device has been delidded, the warranty of the device is voided.


Regards,

Aiman


BD28
Beginner
483 Views

Destructive Physical Analysis, This in order to confirm that device construction and design aligns with the standards for use in different applications and enviroments, that require high reliability. 

 

BD

NurAiman_M_Intel
Employee
474 Views

Hi,


The delidding process is as follow:


  • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
  • Using an exactor knife or blade, slide the lid open along the lid to substrate interface. 


Again, please be noted that  once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


Regards,

Aiman


NurAiman_M_Intel
Employee
474 Views

Hi,


The delidding process is as follow:


  • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
  • Using an exactor knife or blade, slide the lid open along the lid to substrate interface. 


Again, please be noted that  once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


Regards,

Aiman


NurAiman_M_Intel
Employee
474 Views

Hi,


The delidding process is as follow:


  • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
  • Using an exactor knife or blade, slide the lid open along the lid to substrate interface. 


Again, please be noted that  once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


Regards,

Aiman


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