We have been using the FPGA EP4SE530H35I4N and received notice of this component becoming obsolete. With the new part, EP4SE530H35I4G,
1) What will be different besides the solder? (SnAgCu vs SnAg?)
2) Will it use a different finish? If so, what kind?
3) What temperature does it need to be firmly mounted?
4) What differences are there between the parts?
5) Is there a datasheet available?
Thank you for contacting Intel community.
Per ADV2007, the “G” suffix part numbers use the same silicon, product specifications, and are generally form, fit and function equivalent to the “N” suffix part numbers. Hence, there should be no concern on the functional different.
Per ADV1828, selected products will be converted to the leadfree SnAg1.8 solder bumps, replacing the 63/37 Sn-Pb bumps. This is to comply with EU Restriction of Hazardous Substances (RoHS) Directive Exemption 15 scope change. Hence that is the only changes to "G" suffix devices. Same device datasheet can be use.
Process reflow temperature, kindly refer to below page: