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EPM240T100I5N Architecture Variation !

BtsMalta2022
Beginner
1,197 Views

Good morning,

I require assistance to understand the difference in the architecture between two batched of the same product, namely EPM240T100I5N.  

The pictures below show the x-ray image & its corresponding marking the of batch with "holes": 

BtsMalta2022_0-1664351169634.jpeg

BtsMalta2022_1-1664351219075.jpeg

The following pictures, similarly show the x-ray image & its corresponding marking the of batch with " NO holes":

BtsMalta2022_2-1664352087817.jpeg

 

BtsMalta2022_3-1664352142259.jpeg

Our difficulty lays in understanding the difference between the two product architectures, the reason for the "holes" in the first batch and why they are not present in the second batch with "NO holes".

Please evaluate my query and kindly let me know your clarifications for this case.

Kind regards

 Alex Bonello

Purchasing Executive

Bavarian Technology Systems

F16-F18 Tübingen Centre

Mosta Technopark

Mosta MST3000

Malta

Tel: +356 23399109

Fax: +356 21422227

Email: alex.bonello@btsmalta.com

 

 

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1 Solution
Fakhrul
Employee
861 Views

Hi BtsMalta2022,

 

Just got feedback from the internal. Both designs are normal. The “holes” below are not holes, but dimples on bottom of die pad. It is to enhance mold to die pad adhesion. This is a newer design.

Fakhrul_1-1668396540846.jpeg

 

Regards,

Fakhrul

 

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8 Replies
Fakhrul
Employee
1,137 Views

Hi BtsMalta2022,


I need to clarify it internally first and will get back to you.


Regards,

Fakhrul


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BtsMalta2022
Beginner
1,117 Views

Hi Fakhrul,

 

Thank you for following up to my post.

Any updates, please?

Also, may I know your technical position at Intel, please?

Kind regards

 

Alex Bonello

Purchasing Executive

Bavarian Technology Systems

F16-F18 Tübingen Centre

Mosta Technopark

Mosta MST3000

Malta

Tel: +356 23399109

Fax: +356 21422227

Email: alex.bonello@btsmalta.com

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Fakhrul
Employee
1,045 Views

Hi BtsMalta2022,


I'm an Application engineer. I have escalated your issue and currently, this issue has been directed to the Packaging R&D Engineering team. It may take a while to get their feedback. I will plan on letting you know as soon as I learn more information.


Regards,

Fakhrul


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Fakhrul
Employee
1,007 Views

Hi BtsMalta2022,


Just want to update you that I am still pending the answer from the internal team.

I shall come back to you with the findings.


Regards,

Fakhrul


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Fakhrul
Employee
981 Views

Hi BtsMalta2022,


We are pending for a response from subcon. Will get back to you by today or tmr.

BTW, on the 2nd x-ray photo, the x-ray image seems too dark. Can you lower the contrast so that it looks the same as 1st x-ray photo?


Regards,

Fakhrul


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BtsMalta2022
Beginner
961 Views

Hi Fakhrul,

 

Thank you for your feedback.

 

Will forward your suggestion to management and return asap,

 

In the meantime, looking forward to your team's conclusions.

 

Regards

 

Alex

 

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YuanLi_S_Intel
Employee
895 Views

Hi Alex,


We are still pending for the information. Meanwhile do share us if you have any finding on the latest inquiry.


Regards,

Bruce


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Fakhrul
Employee
862 Views

Hi BtsMalta2022,

 

Just got feedback from the internal. Both designs are normal. The “holes” below are not holes, but dimples on bottom of die pad. It is to enhance mold to die pad adhesion. This is a newer design.

Fakhrul_1-1668396540846.jpeg

 

Regards,

Fakhrul

 

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