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Beginner
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Event 111581 / How to proceed to send to analysis 2pcs ALC3-1AB310260004_REP / 5SGXMA7N2F45I3N

Parts found fail by Nokia R&D

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Employee
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Do we have any more granular information than that these devices are failed? Any electrical power measurements or functional failure information?

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Beginner
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Hi Wani, Please find attached the failure description. DC: 1837 PO: 20Z948171 Please provide RMA and shipping instructions in order to send the part to analysis. Thank you and Best Regards, [cid:image001.png@01D215AB.1E6879C0] Alina Dobri Supplier Quality Engineer Calea Torontalului DN6, km5.7 RO-300000 Timisoara Romania Phone number: 0040356474010 Creating value that increases customer competitiveness alina.dobri@flex.com<mailto:alina.dobri@flex.com> www.flextronics.com<http://www.flextronics.com/>
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Employee
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Hi Alina,

 

The details given is insufficient. Please help to share :

 

1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.

 

2. What is the failure symptom? Please elaborate the failure symptom in detail. 

 

3. When did the failure happen? How did you discover the failure? 

 

4. How did you determine the failure? Please elaborate the procedures. 

 

5. Does the failure unit ever working before failure?

 

6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles. 

 

7. Did you swap the failure device to a known good board? Is the failure following the device or board?

 

8. Is this a prototype build or volume/mass production?

 

9. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced. 

 

 

Please do not share confidential information publicly. If you required private message, please do let us know.

 

Thanks!

 

Wani

 

 

 

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Beginner
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Hi WaniMY, Please find the abswers below. Please provide RMA and shipping instructions. 1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units. N/A 2. What is the failure symptom? Please elaborate the failure symptom in detail. Failure of output SERDES after reboot wt soaking 3. When did the failure happen? How did you discover the failure? In field. We do not have this information. 4. How did you determine the failure? Please elaborate the procedures. For common FPGA defects on 100/200G SDFEC items (eg. ADD2, Obelix, FlexFramer) we are supported by a list of corrective actions (provided by Nokia), a list that contains a description of the failures and the corrective action needed (repair indication, RMA note to supplier), based on the encountered defect. The way we determine the failure is mainly based on our experience and the indications received by R&D, due to the large number of failed boards and the variety of failures that we analyzed during the life cycle of these products. If a FPGA needs to be sent to the supplier, it is usually followed by a RMA note/request, as found mentioned above. 5. Does the failure unit ever working before failure? YES 6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles. Everything was in correct profiles/paramaters Thank you and Best Regards, Alina [cid:image001.png@01D5C487.3654BDD0] Alina Dobri Supplier Quality Engineer Calea Torontalului DN6, km5.7 RO-300000 Timisoara Romania Phone number: 0040356474010 Creating value that increases customer competitiveness alina.dobri@flex.com<mailto:alina.dobri@flex.com> www.flextronics.com<http://www.flextronics.com/>
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Moderator
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HI Alina,

 

I already closed another similar case 04416508.

 

Let's discuss both 5SGXMA7N2F45I3N failure case using this forum case.

 

I will initiate private message discussion with you to follow up on the FA analysis support.

 

Thanks.

 

Regards,

dlim

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