Event 113344 - How to send to analysis 1pc ALC3-1AB310260004_REP / 5SGXMA7N2F45I3N

[ADobr]

Part found fail by Nokia R&D

[Zawani_M_Intel]

Hi Alina,

Please tell me the story of this part, how you discovered that it is fails part? How it was measured, and such as that. Also, did you observe a functional failure in the operation of the device?

[ADobr]

Hi Wani, Please see attached the failure description. DC: 1531. PO: 20Z598568 Please provide RMA and shipping instructions in order to send the part to analysis. Thank you and Best Regards, [cid:image001.png@01D215AB.1E6879C0] Alina Dobri Supplier Quality Engineer Calea Torontalului DN6, km5.7 RO-300000 Timisoara Romania Phone number: 0040356474010 Creating value that increases customer competitiveness alina.dobri@flex.com<mailto:alina.dobri@flex.com> www.flextronics.com<http://www.flextronics.com/>

[Zawani_M_Intel]

Hi Alina,

The details is insufficient to generate ERMA. Could you please share with me :

1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.

2. What is the failure symptom? Please elaborate the failure symptom in detail. 

3. When did the failure happen? How did you discover the failure? 

4. How did you determine the failure? Please elaborate the procedures. 

5. Does the failure unit ever working before failure?

6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles. 

7. Did you swap the failure device to a known good board? Is the failure following the device or board?

8. Is this a prototype build or volume/mass production?

9. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced. 

Please do not share confidential information publicly. If you required private message, please do let us know.

Thanks!

Wani

[ADobr]

Hi WaniMY, Please see the answers below. Please provide RMA and shipping instructions. “ 1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units. N/A 2. What is the failure symptom? Please elaborate the failure symptom in detail. Add2 temp = 86°C 29 sigevents ID0 (TxClntResN executed/TxClntResN Reset failed/ADD2ResN executed) 1 sigevent ID1 (TXCLNT_LOF_ERR) NGOCC_IMAGE_ID : 40023900 NGOCC_BUILD_ID : b_171212 EEPROM dump done. Prescreening: OT minor circuit pack failure at 25°C Ch.1: Loss of Signal OTU at 25°C, Alarms Tx DSP OOA and UFL, various alarms on SPIW Defects 3. When did the failure happen? How did you discover the failure? In field. We do not have this information. 4. How did you determine the failure? Please elaborate the procedures. For common FPGA defects on 100/200G SDFEC items (eg. ADD2, Obelix, FlexFramer) we are supported by a list of corrective actions (provided by Nokia), a list that contains a description of the failures and the corrective action needed (repair indication, RMA note to supplier), based on the encountered defect. The way we determine the failure is mainly based on our experience and the indications received by R&D, due to the large number of failed boards and the variety of failures that we analyzed during the life cycle of these products. If a FPGA needs to be sent to the supplier, it is usually followed by a RMA note/request, as found mentioned above. 5. Does the failure unit ever working before failure? YES 6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles. Everything was in correct profiles/paramaters 7. Did you swap the failure device to a known good board? Is the failure following the device or board? YES. After the replacement with a new device, the failure disappeared. 8. Is this a prototype build or volume/mass production? Mass production 9. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced. If the issue is not due to soldering, after the FPGA has been replaced, everything works well. We ask Intel to re-test the device to ensure that it meets the necessary parameters required by Nokia. Thank you and Best Regards, Alina [cid:image001.png@01D5C486.82AC9D70] Alina Dobri Supplier Quality Engineer Calea Torontalului DN6, km5.7 RO-300000 Timisoara Romania Phone number: 0040356474010 Creating value that increases customer competitiveness alina.dobri@flex.com<mailto:alina.dobri@flex.com> www.flextronics.com<http://www.flextronics.com/>

[Deshi_Intel]

Hi Alina,

Since both cases are failing with same OPN 5SGXMA7N2F45I3N, I propose to combine both cases together for ease of discussion.

I will proceed to close this case but we can resume FA support discussion in other case 04416470.

Thanks.

Regards,

dlim