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HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

Dear all,

 

In our fault tree analysis we rely on reliability values for the CycloneIV FGPAs found in the “Intel Reliability Report (1H 2017) – MNL-1085”. To have the a proper argumentation chain, we assume that the devices have been solder on a PCB (not put in a socket mount) for the HTOL-Tests. Can you please confirm this?

 

Best regards,

David

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Re: HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

Hi David,

 

Thank you for contacting Intel community.

 

Please be noted that i am currently checking this request with my internal team. Meanwhile, may i know the purpose of this information to you?

 

Thank you.

 

Regards,

Aiman

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Re: HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

Hi,

 

BI and HTOL tests are done on units that go into sockets on respective boards.

 

Thank you.

 

Regards,

Aiman

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Re: HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

Hi,

 

If there is no further information needed, i will continue to close this case. Feel free to reopen or open a new case if there is further information needed.

 

Thank you.

 

Regards,

Aiman

 

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