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Dear all,
In our fault tree analysis we rely on reliability values for the CycloneIV FGPAs found in the “Intel Reliability Report (1H 2017) – MNL-1085”. To have the a proper argumentation chain, we assume that the devices have been solder on a PCB (not put in a socket mount) for the HTOL-Tests. Can you please confirm this?
Best regards,
David
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Hi David,
Thank you for contacting Intel community.
Please be noted that i am currently checking this request with my internal team. Meanwhile, may i know the purpose of this information to you?
Thank you.
Regards,
Aiman
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Hi,
BI and HTOL tests are done on units that go into sockets on respective boards.
Thank you.
Regards,
Aiman
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Hi,
If there is no further information needed, i will continue to close this case. Feel free to reopen or open a new case if there is further information needed.
Thank you.
Regards,
Aiman

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