Dear all,
In our fault tree analysis we rely on reliability values for the CycloneIV FGPAs found in the “Intel Reliability Report (1H 2017) – MNL-1085”. To have the a proper argumentation chain, we assume that the devices have been solder on a PCB (not put in a socket mount) for the HTOL-Tests. Can you please confirm this?
Best regards,
David
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Hi David,
Thank you for contacting Intel community.
Please be noted that i am currently checking this request with my internal team. Meanwhile, may i know the purpose of this information to you?
Thank you.
Regards,
Aiman
Hi,
BI and HTOL tests are done on units that go into sockets on respective boards.
Thank you.
Regards,
Aiman
Hi,
If there is no further information needed, i will continue to close this case. Feel free to reopen or open a new case if there is further information needed.
Thank you.
Regards,
Aiman
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