HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

[UVonS]

Dear all,

In our fault tree analysis we rely on reliability values for the CycloneIV FGPAs found in the “Intel Reliability Report (1H 2017) – MNL-1085”. To have the a proper argumentation chain, we assume that the devices have been solder on a PCB (not put in a socket mount) for the HTOL-Tests. Can you please confirm this?

Best regards,

David

[NurAiman_M_Intel]

Hi David,

Thank you for contacting Intel community.

Please be noted that i am currently checking this request with my internal team. Meanwhile, may i know the purpose of this information to you?

Thank you.

Regards,

Aiman

[NurAiman_M_Intel]

Hi,

BI and HTOL tests are done on units that go into sockets on respective boards.

Thank you.

Regards,

Aiman

[NurAiman_M_Intel]

Hi,

If there is no further information needed, i will continue to close this case. Feel free to reopen or open a new case if there is further information needed.

Thank you.

Regards,

Aiman