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Dear spong1303,
Thank you for using Intel FPGA Community Forum.
I am forwarding your questions to our Quality Team. Once we receive the information, I will let you know shortly.
I will response to this reply within 1-2 days.
Thank you!
Wani
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Okay, pls help to check & revert as soon as possible.
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Dear Spong1303,
The Max V device can go through wash with DI water. The important part is to make sure the component/pcb after the wash process to dry out the moisture. This is because the Max V package (T100) is a non hermetic plastic BGA. Moisture can enter the plastic and can cause delamination of the plastic especially near the plastic molding compound/die interface.
Bake process recommendation is at least 125C for at least 4 to 8 hours.
Thank you.
Regards,
Wani
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We do not receive any response from you to the previous answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread.
Thank you.
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