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The Max V device can go through wash with DI water. The important part is to make sure the component/pcb after the wash process to dry out the moisture. This is because the Max V package (T100) is a non hermetic plastic BGA. Moisture can enter the plastic and can cause delamination of the plastic especially near the plastic molding compound/die interface.
Bake process recommendation is at least 125C for at least 4 to 8 hours.
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