Reballing recommendation

[ALahn]

Dear Sirs .

Our client have a question about the reballing of the Altera microcircuit in the package of 672-FBGA (client wants to change Pb-free balls to SnPb).

Do you accept reballing process?

Do you have any recommendation for this process?

[ChiaLing_T_Intel]

Hi,

You can refer to AN353 document which describes the board assembly process used in surface-mount technology (SMT) and focuses on the SMT component-to-board reflow soldering.

https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/an/an353.pdf

However, please be noted that Intel FPGA does not recommend to have a mixed alloy reflow process as it is not easy to control. For details, please refer to the link below:

https://www.altera.com/support/support-resources/knowledge-base/solutions/rd06062012_116.html

Thank you

Regards,

Chia Ling

[ALahn]

Dear Sirs . Thank you for prompt reply. AN353 document have detailed description solder process, BGA rework and backward compatibility, but in this document does not refer reballing process. This process is approved by Altera company? Do you have any recommendation for reballing process? With best regards Andrey Lahno Head of Technical Support Communication Systems Equipment 125363 Russia, Moscow, 3/1 Sturvalnaya St. Tel/Fax +7 (495) 925-50-12

[ChiaLing_T_Intel]

Hi,

Sorry to let you know we do not have the reballing process guidelines but we will only provide the reflow guidelines of the FPGA.

Thank you

Regards,

Chia Ling