Dear Sirs .
Our client have a question about the reballing of the Altera microcircuit in the package of 672-FBGA (client wants to change Pb-free balls to SnPb).
Do you accept reballing process?
Do you have any recommendation for this process?
You can refer to AN353 document which describes the board assembly process used in surface-mount technology (SMT) and focuses on the SMT component-to-board reflow soldering.
However, please be noted that Intel FPGA does not recommend to have a mixed alloy reflow process as it is not easy to control. For details, please refer to the link below: