FPGA, SoC, And CPLD Boards And Kits
FPGA Evaluation and Development Kits

soldering open issue

WOsca
Beginner
1,283 Views

Issue Des. : Currently we find parts(EP3C5F256C6N)have open issue after soldering process at the ICT test station in our production line.

Total input: 100 pcs

Failure QTY:44 pcs ( 43 pcs in 44 is manufactured in MALAYSIA, while the rest one is from Korea which we used before with no issue)

Failure rate: 44%

 1. We have done 5D XRAY inspection with no findings regarding to the soldering condition, the soldering seems no obvious problem.

2. Reheat 5 pcs failure EP3C5F256C6N on board, retest the ICT with 1 pc test pass and 4 pcs still failed

3. Replace the NG EP3C5F256C6N(Malaysia) with a new EP3C5F256C6N(Korea), ITC test pass

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YuanLi_S_Intel
Employee
362 Views

Hi WOsca,

 

I have received the enquiry. I will continue to support you via private message.

 

Thank You.

 

Regards,

YL

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