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xytech
New Contributor I
539 Views

Allowed maximum Mechanical pressure when mounting heatsink on top of EM2120L01QI

Hi,

we use three pcs of EM2120L01QI to power A10 FPGA, .

Desinged independent heatsinks or ONE whole large heatsin which mounted on the top of EM2120.

We use compressible thermal pad for interfacing material placed between case top of A10 and metal heatsink.

Certain pressure need to apply on IC to keep the thermal pad contact with IC surface tightly to ensure the good thermal conductivity.

So what is the recommended Mechanical Pressure for EM2120L01QI ? (unit is MPa or PSI ,Pounds per square inch ), or what is the pressure limit so as to keep IC from being destroyed by over stressed, as well as avoiding long term crack of BGA balls.

 

Any comments are welcome. 

Thanks

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7 Replies
xytech
New Contributor I
183 Views

up

xytech
New Contributor I
183 Views

up​

xytech
New Contributor I
183 Views

up

Mostafa_Intel_AE
Employee
183 Views

Hello Yi Xiao,

 

Sorry for late response, I am working with the quality team to get an answer for your question.

I will get back to you soon.

 

Regards,

Mostafa

 

Mostafa_Intel_AE
Employee
183 Views

Hello Yi Xiao,

 

Below is Intel quality team feedback.

"Compressive loads alter both the distribution and the loading of the solder joint. Intel PSG doesn't currently have any data on the compressive load impact on the inquired EM2120L01QI product."

 

Regards,

Mostafa

 

xytech
New Contributor I
183 Views

Although the problem is not solved. thanks all the same​

Mostafa_Intel_AE
Employee
183 Views

Hello Yi Xiao,

We are sorry for not able to solve your issue, Enpirion team doesn't perform that test .

I will check internally if they will perform the mechanical pressure test, but i can't promise that they will do that soon.

 

Regards,

Mostafa

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