Allowed maximum Mechanical pressure when mounting heatsink on top of EM2120L01QI

[xytech]

Hi,

we use three pcs of EM2120L01QI to power A10 FPGA, .

Desinged independent heatsinks or ONE whole large heatsin which mounted on the top of EM2120.

We use compressible thermal pad for interfacing material placed between case top of A10 and metal heatsink.

Certain pressure need to apply on IC to keep the thermal pad contact with IC surface tightly to ensure the good thermal conductivity.

So what is the recommended Mechanical Pressure for EM2120L01QI ? (unit is MPa or PSI ,Pounds per square inch ), or what is the pressure limit so as to keep IC from being destroyed by over stressed, as well as avoiding long term crack of BGA balls.

Any comments are welcome. 

Thanks

[xytech]

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[xytech]

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[xytech]

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[Mostafa_Intel_AE]

Hello Yi Xiao,

Sorry for late response, I am working with the quality team to get an answer for your question.

I will get back to you soon.

Regards,

Mostafa

[Mostafa_Intel_AE]

Hello Yi Xiao,

Below is Intel quality team feedback.

"Compressive loads alter both the distribution and the loading of the solder joint. Intel PSG doesn't currently have any data on the compressive load impact on the inquired EM2120L01QI product."

Regards,

Mostafa

[xytech]

Although the problem is not solved. thanks all the same​

[Mostafa_Intel_AE]

Hello Yi Xiao,

We are sorry for not able to solve your issue, Enpirion team doesn't perform that test .

I will check internally if they will perform the mechanical pressure test, but i can't promise that they will do that soon.

Regards,

Mostafa