I have a technical question regarding Enpirion product for powering FPGA.
In the family AECQ100 like EN6337QA and EN63A0QA, are these component hybrid?
In other words, I would like to know, if possible, if these components use the same wafer for all internals parts (mosfet, controlleur, inductor...) or if each internal component are manufactured in different wafer and connected together using bonding or other technique later.
These Enpirion products are hyperd which means that the Die (MOSFET+controller in same wafer) and other components (Inductor and filter capacitors) are mounted on the same substrate (which is a lead frame in Enpirion/Intel case).
But these two Enpirion/Intel products don't use the same internal components where they are different current capability regulators and require different components values.