Hello Jenanne,
To avoid having a soldering bridge with Enpirion devices, basicky try to avoid having any routing underneath the package where most of the pad on teh keep out area are internally connected.
Also its recommended to use the stencil opening for the thermal pad (PGND) less than 30% of the thermal pad area and try to divide it for 3 to 5 pcs.
Please check the below link where it has some useful information that could help you to avoid the soldering bridge issue.
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/enpirion_soldering_guidelines.pdf
Regards,
Mostafa
