Part Information Request

[REE0]

I’m a Radiation Effects Engineer  performing a component Single Events Effects (SEE) sensitivities assessment to the part: 10CL040YU484A7G.

I would like to know the following wafer fabrication information for the mentioned part:

1. Initial Release Date and Latest revision.

2. the minimum feature size (Distance between the elements that make up the structures on a chip, commonly known as wafer node, tech node or feature size). The size of the features are measured in nanometers. A 22 nm process technology refers to features 22 nm or 0.022 µm in size. Also called a "technology node" and "process node," early chips were measured in micrometers.

3. the process technology used (Semiconductor technology, example: bipolar, MOSFET, CMOS, etc.)

Thanks.

[NurAiman_M_Intel · Accepted solution]

Hi,

Thank you for contacting Intel community.

1. Do you mean release date n latest revision of the C10 LP? What do you mean by this?
2. Process technology for C10 LP is 60nm.
3. Any reason to know this information?

You can also refer to C10 LP website for more information.

Regards,

Aiman

[REE0]

Hi,

thanks for the information. 

The reason to know that information is because I’m a Radiation Effects Engineer  performing a component Single Events Effects (SEE) assessment for a circuit board for a confidential client. 

[NurAiman_M_Intel]

Hi,

Apologize that I missed out the link to our webiste;

https://www.intel.com/content/www/us/en/products/details/fpga/cyclone/10/lp.html

Did you get the information needed through our website?

Regards,

Aiman

[NurAiman_M_Intel]

I’m glad that your question has been addressed, I now transition this thread to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.