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How to test heat sink can meet TDP requirement?


I wonder How to test my thermal solution can meet cpu TDP requirement?

I am now using TAT to test CPU Thermal condition.(mobile CPU skylake U type)

To let CPU power consumption meet TDP I choose TDP workload for my test loading.

But the "package power" is lower than SKU's TDP.

I find that Graphic frequency is about 350MHZ.

When I change the graphic frequency setting to "No Limit".

The graphic frequency will up to 950MHZ and package power is near TDP level.

So below are my questions:

1.What is the standard to test CPU thermal condition?

2.If question 1 answer is choosing TDP workload for loading.Do I need to change graphic frequency to let package power approach TDP?

Thank you!

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Thank you very much for contacting the Intel® Communities Team, Abel.



For us to better assist you with this inquiry you have, please share this question with the Intel® Resource & Design Center.




Antony S.
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