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What 4th gen Xeon Gold processors has not MCM chip on it

mgumus
Beginner
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Hi, i am looking for a list i can see which 4th generation of the Intel Xeon Gold processors has MCM (Multi Core Module). And what not.

 

 

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Allan_A_Intel
Moderator
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Hello mgumus,


Thank you for reaching out with your inquiry. I understand you're interested in finding out about 4th generation Intel Xeon Gold processors and their MCM chip configuration.


I'm here to assist you with your question. Let me look into this for you and gather the accurate information. I appreciate your patience and will provide you with a detailed response as soon as possible.


If you have any other questions in the meantime, feel free to ask. Your curiosity is important to us, and we're here to support you.


Best regards,


Allan A.

Intel Customer Support


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Allan_A_Intel
Moderator
965 Views

Hello mgumus,


Thank you for your patience! I'd be happy to help clarify the terms for you. You mentioned "Multi-Core Module (MCM)," but I want to ensure we're on the same page. Let's distinguish between two related concepts:


  1. Multi-Chip Module (MCM):
    1. This refers to a packaging technology that combines multiple semiconductor chips or dies within a single package.
    2. If you're looking for information on Multi-Chip Modules (MCMs), please let me know.
  2. Multi-Die Package (MDP):
    1. This is a specific type of semiconductor package that contains multiple integrated circuit dies within the same physical package.
    2. If you're seeking details on Multi-Die Packages (MDPs), I can assist with that as well.


For Multi-Die Packages (MDPs):


If it turns out that you're looking for different information or have more questions, please don't hesitate to let me know. I'm here to help and can research further based on your specific needs.


Warm regards,


Allan A.

Intel Customer Support


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Allan_A_Intel
Moderator
930 Views

Dear mgumus,


I hope this message finds you well. I wanted to follow up on my previous message regarding the distinction between Multi-Chip Modules (MCMs) and Multi-Die Packages (MDPs).


In my previous message, I provided detailed information on both concepts and shared a link to the Intel® Xeon® Scalable processors Datasheet for Multi-Die Packages (MDPs). If you have any further questions or need additional assistance with this topic, please do not hesitate to reach out.


I understand that sometimes messages can get lost or overlooked in a busy inbox, and I want to ensure that you have all the information you need. If there's anything specific you'd like to discuss or clarify, please feel free to let me know, and I'll be more than happy to assist you.


As a friendly reminder, I will keep this case open for the next 3 business days to give you ample time to respond. After that period, if I don't hear from you, I will proceed to close the case. However, please know that our support team is always here to help you whenever you require assistance in the future.


Thank you for your patience and for choosing Intel for your technical inquiries. We value your business and are committed to providing you with the best support possible.


Warm regards,


Allan A.

Intel Customer Support


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Allan_A_Intel
Moderator
892 Views

Dear mgumus,


I trust this message finds you well. I wanted to follow up on our previous discussion regarding Multi-Chip Modules (MCMs) and Multi-Die Packages (MDPs).


In my last message, I provided detailed information and shared a link to the Intel® Xeon® Scalable processors Datasheet for Multi-Die Packages (MDPs). If you have any further questions or require additional assistance, please do not hesitate to reach out.


However, since I haven't received a response to our previous messages, I will proceed to close this case. Please know that our support team is always available to assist you with any future inquiries.


Thank you for choosing Intel for your technical needs. We appreciate your business and are committed to providing excellent support.


Warm regards,


Allan A.

Intel Customer Support


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