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10CL040YU484A7G

KLiew7
Beginner
531 Views

Hi,

Could you please help to review the below question and advise?

As per supplier :

Please advise the lead finishing for this PN#10CL040YU484A7G.
If gold, please advise thickness & gold plating process (ENIG: Electroless Nickel Immersion Gold
ENEPIG: Electroless Nickel Electroless Palladium Immersion Gold, NiPdAu: Nickel Palladium Gold)

 

Thanks.

Regards,

Kent

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AminT_Intel
Employee
482 Views

Hello,

 

The evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages.

 

Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf

 

Thank you.

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2 Replies
AminT_Intel
Employee
483 Views

Hello,

 

The evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages.

 

Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf

 

Thank you.

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AminT_Intel
Employee
413 Views

 I’m glad that your question has been addressed, I now transition this thread to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.

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