10M16DCU324I7G package

[XQSHEN]

Hello,

How can I know if 10M16DCU324I7G package belongs to which one in below table?

[AminT_Intel]

Hello,

OPN: 10M16DCU324I7G 

Package Type: U

Package Code: 324

From Altera Device Package Information they are 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond. Thus, they are 0.70mm UBGA (wirebond) from Table 3.

Thanks

[AminT_Intel]

Hello,

Sorry there was a typo. It was 0.80 mm not 0.70 mm

[XQSHEN]

Thanks, so I should set PCB solder pad size = 0.34, solder mask = 0.4, right?

[AminT_Intel]

Hello,

Please follow the recommended pad size on of your device from the table.

Thanks

[XQSHEN]

Is my understanding of the table correct?

set PCB solder pad size = 0.34, solder mask = 0.4

[AminT_Intel]

Hello,

Yes. Please refer to page 6 of this document: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an114.pdf

Thank you.

[AminT_Intel]

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