I'm trying to create a PCB footprint for an Intel MAX 10 FPGA with a 144-EQFP package, specifically P/N 10M02SCE144A7G. I'm just trying to find the correct package dimensions. I found this document through the Intel site: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf
however the guy who manages our eCad library found one with a different thermal pad dimension.
Can anyone confirm that this is the most current package dimensions for 10M02SCE144A7G?
Thank you for contacting Intel community.
The link provided through Intel website:
Customers can always refer to Intel FPGA packaging specification and dimension page for latest info related to packaging dimension.