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Hi
I'm trying to create a PCB footprint for an Intel MAX 10 FPGA with a 144-EQFP package, specifically P/N 10M02SCE144A7G. I'm just trying to find the correct package dimensions. I found this document through the Intel site: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf
however the guy who manages our eCad library found one with a different thermal pad dimension.
Can anyone confirm that this is the most current package dimensions for 10M02SCE144A7G?
Thank you!
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Hi,
Thank you for contacting Intel community.
The link provided through Intel website:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf is correct.
Customers can always refer to Intel FPGA packaging specification and dimension page for latest info related to packaging dimension.
https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg.html
Thanks.
Regards,
Aiman
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Hi Aiman,
Thank you for confirming that.
Karl
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I'm also confused. I can easily find the package specification. But I can't find a recommended footprint or 3D model of the package. Does intel provide these?

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