If placed in a test chamber pressurized to 25,000+ ft will the IC be damaged in anyway and will the performance be derated in some manner? If so what properties will be derated? Does the posted operating temperatures take into account convection at ground level or is it based on conduction?
Intel has been studying the effects of SEUs on its device for many process generations and has built up extensive experience in both the reduction of soft-error rates through SEU-optimized physical layout and process technology, and in soft-error mitigation techniques. Intel introduced the industry's first automatic cyclical redundancy check (CRC) and removed the extra logic and complexity requirements common to other error checking solutions. Intel® device families are all tested for SEU behavior and performance using facilities such as Los Alamos Weapons Neutron Research (WNR) using standard test procedures defined by JEDEC's JESD-89 spec. To understand further of the SEU, you can refer to the link below:
For Max 10 SEU report generation, you can refer to the video clip below:
Please be noted that per JESD89A, it is based on the altitude of 10,000 feet above New York City.