I would like to perform a boundary scan on the device before the heatsink is applied.
I am wondering what the power dissipation is during boundary scan (JTAG) mode? I want to make sure it will not overheat.
Performing boundary scan will not impact any heat as the device is still in idle. You can get the BSDL (boundary-scan description language ) file from https://www.intel.com/content/www/us/en/programmable/support/support-resources/download/board-layout... where you can use it to performed testing.