Can you help me do FA for FPGA EP4CGX75DF27C7N?

[ChiaLing_T_Intel]

Hi,

Thank you for contacting Intel Community. Please be noted that Intel FPGA requires details information for failure analysis request. Please help to answer questions below in order for us to better understand your position.

1. Please provide full device details.

1.1. Device name:

1.2. Full part number:

1.3. Date code:

1.4. Lot number:

1.5. Trace code:

1.6. Distributor name:

2. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.

3. What is the failure symptom? Please elaborate the failure symptom in detail.

4. When did the failure happen? How did you discover the failure?

5. How did you determine the failure? Please elaborate the procedures.

6. Does the failure unit ever working before failure?

7. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.

8. Did you swap the failure device to a known good board? Is the failure following the device or board?

9. Is this a prototype build or volume/mass production?

10. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced.

Thank you

Regards,

Chia Ling

[ChiaLing_T_Intel]

Hi,

How are you? I sincerely hope you are doing all fine. Do you have any update to me? Is there anything else I can further assist you? Kindly get back to me if you still need my assistance.

Thank you

Regards,

Chia Ling

[ChiaLing_T_Intel]

Hi,

Do you have any update this FA request? Anything else on this issue I can do for you? Please do not hesitate to let me know if you need further assistance. 

Thank you

Regards,

Chia Ling

[FTang]

Hi Chia,

Please find my answer as below. Any query, please let me know. Thanks.

1.1. Device name: Stratix® IV

1.2. Full part number: EP4CGX75DF27C7N

1.3. Date code: 1831/1813/1819

1.4. Lot number: CAAAF1831E/CAAAF1813E/CAAAF1819E

1.5. Trace code: N/A

1.6. Distributor name: ARROW ASIA DISTRIBUTION LIMITED

2. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units. failure rate: 51/26097

3. What is the failure symptom? Please elaborate the failure symptom in detail.

Top failure code is GET_ROMMON fail at BST station, detail please find our internal FA report.

4. When did the failure happen? How did you discover the failure?

Every new build will have this kind of failure. It failed at functional test at our side.

5. How did you determine the failure? Please elaborate the procedures.

X-ray check any process issue; Swap test has done and failure follows the component;

6. Does the failure unit ever working before failure?

It passed ICT test, failed at the second test station.

7. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.

It didn't violate the solder re-flow temperature profile. Shelf life also meet the standard define.

8. Did you swap the failure device to a known good board? Is the failure following the device or board?

Yes. Failure follows the device.

9. Is this a prototype build or volume/mass production?

Mass production.

10. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced.

Please find FA report for detail.

Best regard!

Fairy Tang

[ChiaLing_T_Intel]

Hi Fairy,

Thanks for the information. A respective ERMA team will be continued support for the next steps.

Thank you

Regards,

Chia Ling