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Component Shelf Life

thamx
Beginner
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I'm conducting research over the shelf life of components, the effects of ageing and the reason why different suppliers define different shelf life rules.

We, as a factory, place a lot of Intel (former Altera) components and those are delivered with a shelf life specified.
Other research concludes shelf life has, in lead-free finishes, no (big) influence on solderability and thus plays no significant role.

What I'm looking for is the rationale behind a shelf life definition: how is it defined and what are effects on the components if we exceed this shelf life?

The reason for my research is to define a clear, well-founded conclusion how we, as an EMS factory or even as an Industry, define and handle shelf life.

I'm looking forward to your response, hopefully some (research) papers are available.

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AminT_Intel
Employee
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Hello,

 

We do not have research paper and we will usually update the status of our FPGA on this website: PCNs, PDNs, and Advisories

 

We do have KDB about shelf life of a ball-grid array (BGA) device after removing it from its dry pack: https://www.intel.com/content/www/us/en/support/programmable/articles/000079237.html

 

Here's another related document: https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/pcn/adv1616.pdf

 

We follow standard JEDEC J-STD-033B.1

 

I hope this helps.

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AminT_Intel
Employee
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 We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.

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