I don't see any features mentioned where you can configure the device to shut itself down (unconfigure) upon reaching a temperature threshold.
We sometimes add this features in our designs.
It's really not complex : we read the internal die temperature and we shut down most high speed clock and heavy-duty sections, just leaving the control/command blocks alive to allow reporting and status.
We started with our Stratix V board which can dissipate a lot when very full and heavy signal processing + very high speed communication logic in it.
But this solution has limits ! Some families & largest dies have so high leakage that even with no clock at all, the temperature can diverge without proper cooling.
For the latest families, it's probably wiser to monitor the die temperature by the power sequencer and shut down properly the whole chip when things get out of hand. My 0.05$.
Usually, we implement Board Management Controller (BMC) to automatic Shut-down the Arria 10.
If Arria 10 reach certain temperature, BMC will to shut down board.
We implement BMC in Arria 10 Programmable Acceleration Card (PAC). you may refer below: