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What are the changes in the appearance screen printing of this model EP3C80F484I7N? Is there any change in the appearance of the shell? What adjustments have been made to the production process?
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Hi,
Please refer to the following documents:
- PCN0904 Cyclone® III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change (intel.com)
- PCN1205 ADDITIONAL ASSEMBLY SOURCE (ASE) AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES (intel.com)
Best Regards,
Mengzhe

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