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Hi Intel Team,
Our incoming found 1pc FPGA missing ball. Appreciate your support to channel us with respective PIC to advise the next disposition. Refer below reject details:-
Part Number |
AE1822-5776LF |
Description |
IC PLD FPGA unprogrammed 5SGSMD8 1517-FB |
Quantity |
1 pcs |
Issue |
MISSING BALL |
MPN |
5SGSMD8K2F40I2LN |
Date Receive |
08/07/2020 |
P/O# |
4514957540 |
Vendor |
INTEL |
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Just to top-up, we have another 20 pcs which yet to screen. we can return back to you for rescreen. Please advise the next step.
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Hi,
Thank you for contacting Intel community.
Kindly share below information:
- DN
- Affected lot#
- Customer received date
- Method of detection
- Condition of outer, inner, MBB and trays
For your information, Intel PSG perform 100% Ball Scan prior to shipment, so it's unlikely that the device will have been shipped with a missing ball. There is a high possibility that it was damaged in transit or shipping or improper storage. We have ball scan and visual test. Plus, we have drop test proved packing. The purpose of production testing during manufacturing is to screen out bad units and in the case of this IPS, the missing solder ball would not pass the open/short test. Intel PSG Reliability Report had stated clearly that Intel PSG performs comprehensive testing and manufacturing controls on all its products.
We could guarantee devices leave factory door in good condition. Once shipment leaves factory, we are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no ERMA/RMA will be proceeded due to the missing ball issue reported.
Customer could investigate this to come out some corrective action. Meanwhile, you may refer to the solution below on the maximum downward pressure that can be applied to the top of BGA
Thanks.
Regards,
Aiman
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Hi Intel team,
Please below on the info as per request.
Kindly share below information:
- DN - 807935373
- Affected lot# S005AF3G1 & S004AK56W1
- Customer received date - 08/07/2020
- Method of detection - Visual inspection
- Condition of outer, inner, MBB and trays - All are in good condition.
Thank you
Fathimah Mohd
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Hi,
Thank you for your response. Per my previous response, we cannot proceed with FA for this case, however I will provide the test log of the device.
Before that, please provide us further information as below:
-Photos of outer cartons (all angles)
-Inner box (all angles)
-MBB (both sides)
-Trays
Thanks.
Regards,
Aiman
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Hi,
Please provide us the effected OPN so we could check the shipment history.
Also, photos of outer cartons (all angles), inner box (all angles), MBB (both sides) and trays.
Thanks.
Regards,
Aiman
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Hi
Is there any update for this case?
Thanks.
Regards,
Aiman
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Hi Intel Team,
Please refer to attach picture as per request as per below.
There is limited off attach picture.
I will share more details via email
Please provide us the effected OPN so we could check the shipment history.
Also, photos of outer cartons (all angles), inner box (all angles), MBB (both sides) and trays.
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Hi,
Thank you for your response. Kindly reply to the forum email that I have sent to you with photos that does not fit in the forum and the effected OPN number.
I have also provided the test log for your references.
Thanks.
Regards,
Aiman
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Hi,
I am putting this here in case you did not received my email response:
I have respond to your email on Nov 17 per below:
"Hi Lee,
Sorry to tell you that this is an invalid ERMA. However, we are looking into this issue and might consider to perform simulation test. Hence, kindly share the photos of the packaging items for our investigation. Apologize for the inconveniences from our side. Thanks. "
I am not sure if you haven't received the email.
Kindly share the photos of packaging items for investigation.
Best regards,
Nur Aiman
Intel Customer Support

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