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Jabil Wuxi _ Failure Analysis(FA) on part 5M2210ZF256C5N (CPN: 300-J9127R6 )

Angela_xu
Beginner
251 Views

Jabil WuXI received 2pcs customer field returned component ,we have to request FA to manufacturer base on customer requirement.

Pls help co-ordinate this FA request and release RMA# to us for sample return ASAP. Thanks!

 

JPN: 300-J9127R6

MPN: 5M2210ZF256C5N

Supplier: Intel

Qty:2pcs

PO#:9085311990

GRN#1088546851

Problem Description: NO BOOT

Debug analysis finding: ①Sample1(SN#032017002547) P1V8_EBOD to GND short, (U9 K6 PIN)

② Sample2 (SN#)032017002536  P1V8_EBOD&P3V3_EBOD to GND short(U9  K6  T14 PIN)

Detailed information refer to attachments.

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4 Replies
Zawani_M_Intel
Employee
226 Views

Hi Angela_xu,

For your information, Intel FPGA Reliability Report had stated clearly that we perform comprehensive testing and manufacturing controls on all its products. Altera Reliability Report Figure 1 shows a typical product manufacturing flow. Thus, the devices are leaving factory in good and working condition. Furthermore, Altera can provide automotive supply chain with the highest levels of quality and reliability because all of Altera’s manufacturing partners (TSMC, ASE and AMKOR) are certified and registered to ISO/TS 16949 automotive industry quality standard. Please refer Altera Reliability Report page 4, Altera Quality System:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/rr/rr.pdf 

By referring to the Intel FPGA Failure Analysis Service - we test all devices for shorts and opens before the devices leave our factory. All our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units and in the case of this case, short in circuit diagram

https://www.intel.com/content/www/us/en/programmable/support/support-resources/operation-and-testing... 

The short issue is highly suspected caused by an EOS event. This may be caused during reflow or just by someone touching the device or board without discharging themselves. This issue is generally due to Electrical Overstress (EOS) issue and we don’t see any valid reason to bring the device in for failure analysis.

You can let me know if you have any concern or questions.

 

Thanks!

Regards,
Wani

Angela_xu
Beginner
198 Views

Hi Wani,

 

Considering this is filed failure case and customer (NetApp) request us to do component level FA, we strongly suggest you to support the FA.

 

These two boards mounted U9 (5M2210ZF256C5N) onto the board, assembly into canister then tested pass and shipped out, and also passed CTO test, but it failed at field later. CTO/Field customer should have no chance to touch the U9 inside canister.

 

if EOS, at least need understand the reason causing U9 EOS for future prevention. Thanks!

Zawani_M_Intel
Employee
173 Views

Dear Angela_xu,

 

We will continue support this case through private email as some confidential info is required.

Please do let me know if you having problem to access to that email.

 

Thanks!

 

Wani

Angela_xu
Beginner
160 Views

Hi Wani,

 

Attached completed Device Problem Report (DPR) for your reference.

Pls release RMA# to us for sample return and start FA process ASAP. Thanks!

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