What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
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After checking your inquiry, we noticed it is regarding Intel® Arria 10 GX FPGA - Field Programmable Gate Array (part number 10AX066N2F40I1HG). We have a forum for these specific products and inquiries so we are moving this to the Programmable Devices forum so it can get answered more quickly.
Intel Customer Support Technician
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Are you referring to process reflow? If yes, kindly go to the link below for further information:
- Hi -
- No; we are performing a Destructive Physical Analysis (DPA) on these parts as required by the US Department Of Defense. We are not trying to solder this IC to a board. We are trying to remove the lid to be able to perform Scanning Acoustic Microscopy on the part. How would you recommend that we remove the lid from the part without damaging the internal parts?
Unfortunately, that did not tell me how to remove the lid from the IC without damaging the die and other internal components. Can you please provide the process we can follow to remove the metal lid from the Integrated Circuit without damaging the die and other internal components. It appears the metal lid is held on to the die by an epoxy.
I have emailed you the contact person for further action. Please take a look and let me know once you contacted the person.