Max V Stencil Design 64-Pin Plastic Enhanced Quad Flat (EQFP)

[inte1_support_suxs]

Looking for the recommended stencil design for this component.  Seems like a critical parameter since there are no GND leads on the part and it relies solely on the GND slug on the bottom for connection.

Can't find this anywhere online and their is no phone support for the FPGA folks.  What a McMess.

Would like to see the stencil pattern and recommended thickness as well.

[FvM]

Hi,
stencil parameters are usually set depending on the components used on a PCA. Thickness is selected according to big pad components, e.g. power transistors or power IC. With a general purpose stencil of 100 µm, the EQFP 64 exposed pad won't need to be divided into smaller squares. If your stencil is thicker, you'll probably use segments.

You'll notice that exposed pad to PCB clearance can vary between 50 and 150 um according to datasheet, it's impossible to dispense solder paste exactly. Fortunately the only requirement is to have the pad safely connected, there's no massive heat dissipation of the part. 

Another question is how to implement ground vias. You have the choise between VIPPO (via-in-pad plated over), thin open vias in pad (e.g. 200 µm) or vias around the pad.

[cfkd]

Hi,

For the MAX V stencil parameters, kindly download the packaging information about your device from the link: https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/package.html?family=MAX_V

Kindly refer to "Package Outline Dimension Table" and the stencil parameters for your design reference.

Kind regards,

Chee

[cfkd]

As we do not receive any response from you on the previous question/reply/answer that we have provided. Please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

[cfkd]

Hi,

Kindly discard the previous comment from my end; my apologies.

In order to provide the stencil recommendation and thickness, could you provide us your project details? The details will be used to search for the right documentation if available.

Best regards,

Chee

[cfkd]

Hi,

Unfortunately, we cannot provide official documentation for our legacy devices.

Kindly let us know if there are other questions we can answer.

Best regards,

Chee