Dear Intel team,
We would like to know technical info of FPGA Agilex F Tile (AGFA027R31C2E2V)
- Pad recommendations
- Solder paste opening recommendation
- Reflow profile.
Thanks in advance
Thank you for reaching out. Allow me some time to look into your issue. I shall come back to you with findings.
Thank you for your patience.
I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual . I will plan on letting you know as soon as I learn more information.
Really appreciate your patience.
As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.