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I want to do a thermal analysis using the EP2C35F672 FPGA using the FineLine BGA 672 pin package. I need the thermal resistance for junction to board (or ambient) and junction to case (top). Thanks. Any help is appreciated.
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The Altera package datasheet has some data for junction-to-case and junction-to-ambient thermal resistance, the latter with different air flow rates.
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i thnk FVM is Write
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Your info was very helpful...thanks.
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