Hi Jesus Rodriguez,
Need your help to provide some details :
1. What is the failure symptom? Please elaborate the failure symptom in detail.
2. When did the failure happen? How did you discover the failure?
3. How did you determine the failure? Please elaborate the procedures.
4. Does the failure unit ever working before failure?
5. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
6. Did you swap the failure device to a known good board? Is the failure following the device or board?
Please do not share confidential info publicly. If you need to send any confidential info or document, please send it privately.
I sent you all related information to your personal mail. please your help to follow-up this requirement, our customer is waiting for the FA results, thanks.