Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
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pdn1926-opn-list.xlsx の下記(a)(b)の影響で基板変更は必要ですか。 (a) Change from Dual-Piece Lid to Flat Top Single-Piece Lid (b) Change from Lidless to Molded (Thermal Composite) Package

KJalte2
New Contributor I
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The list of affected Ordering Part Numbers (OPNs) can be downloaded here:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pdn1926-opn-list.xlsx

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JonWay_C_Intel
Employee
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​Hi @KJalte2​ 

 

The package outline is different with the new package. You can compare the dimension for both the "N" and "G" at https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_II 

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