EN2342QI thermal dissipation

[Altera_Forum]

Hi, 

 I have some concerns about thermal dissipation of the EN2342QI on space applications. The major concern is about those power pads on the bottom of the chip that specifically says "is not to be mechanically or electrically connected to the PCB". It will be enough with the GND plane and vias?  Thanks in advance for your replies.

[Altera_Forum]

I don't know the answer but I'll move this to the non-SoC section of the forum since this section is for the SoC FPGAs which have ARM processors inside them. 

 Also can you clarify what the question is about? I can't tell if you are asking if there will be sufficient heat dissipation through the pads to the board or if your concern is power reliability related.

[Altera_Forum]

Yes. If you follow the requirements of the Datasheet, you will get the performance promised in the Datasheet :-). The thermal conductivity from the device to the circuit board is specified while the device is connected to the board as described in the Datasheet. 

 If this is going to be a vacuum application, you might want to look at the metallurgy.  Dale, NARSC