Hechen_Wang
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Hechen Wang (Member, IEEE) received the B.S. degree in microelectronics and solid-state electronics from the University of Electri... See more

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  • 01-30-2023

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User Bio
Hechen Wang (Member, IEEE) received the B.S. degree in microelectronics and solid-state electronics from the University of Electrical Science and Technology of China (UESTC), Chengdu, China, in 2012, and the M.S. and Ph.D. degrees in electrical and computer engineering from Auburn University, Auburn, AL, USA, in 2013 and 2018, respectively, with a focus on the design of integrated digital frequency synthesizer circuits and time-to-digital converters. In 2014, he was an RFIC Design Engineer with InnoPhase, Inc., Chicago, IL, USA. From 2015 to 2018, he was a Ph.D. Graduate Student Researcher with the Auburn RFIC Design and Testing Laboratory, Auburn University. Since 2018, he has been with Intel Corporation, Hillsboro, OR, USA. He is currently a Research Scientist with Intel Labs. He has authored or coauthored more than 40 IEEE conference and journal articles, patents, and book chapters. His current research interests include mixed-signal circuits, data converters, digital frequency synthesizers, wireless communication systems, and analog/mixed-signal compute-in-memory for AI applications. Dr. Wang was a co-recipient of the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Best Student Paper Award in 2016 and the IEEE Custom Integrated Circuits Conference (CICC) Best Regular Paper Award in 2017, and a TPC Member of the IEEE International Symposium on Quality Electronic Design (ISQED).
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Member Since ‎01-30-2023