As the only American company that designs and manufactures leading-edge semiconductors, Intel is committed to securing the domestic chip supply chain and restoring semiconductor leadership. By collaborating with the U.S. government (USG), Intel aims to bolster the resilience of U.S. technological systems through the advancement of secure, cutting-edge solutions.
Projects like Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP) with the U.S. Department of Defense (DoD) have significantly accelerated the development of advanced semiconductor technologies and exemplify the power of aligning commercial and public interests to drive innovation and enhance national security.
We have made remarkable progress, thanks to the pivotal role played by Intel Foundry and our unwavering commitment.
- Industry-leading Intel 18A process technology has entered risk production
Leveraging Intel Foundry's cutting-edge Intel 18A process node has been a game-changer for the defense sector. For the first time in decades, the USG and Defense Industrial Base (DIB) customers can access leading-edge technology at the same time as commercial customers. With the use of Intel 18A technology for their latest microelectronics and mission platforms, DIB customers will be able to deliver significant improvements to the defense industry’s size, weight, power, and cost (SWaP-C) requirements.
As announced by Intel Foundry’s SVP and GM, Kevin O’Buckley, the final Intel 18A PDK 1.0.1GA was released for customers in Q4 2024, and Intel 18A technology is now in risk production. - Building support for ITAR-compliant test chips on Intel 18A
One of the most exciting announcements at IPSS was the enablement of International Traffic in Arms Regulations (ITAR)-controlled access to test chips manufactured on Intel 18A technology. This capability ensures that DIB customers can leverage our advanced technologies while meeting the government requirements for their programs. We are accepting Intel 18A ITAR test chip shuttle reservations for tape-outs targeted in the first half of 2026. - Expanding the Foundry roadmap with the 12nm offering
For customers needing onshore access to mature technologies, Intel Foundry will offer an industry-standard 12nm process technology beginning in 2026. This technology will utilize FinFET capabilities and is targeted to be manufactured in Arizona. The DIB customers can begin design tape-outs starting in late 2026. - Scaling advanced packaging onshore
To deliver the needs for mission systems, Intel Foundry offers its advanced heterogeneous packaging technologies onshore, including Embedded Multi-die Interconnect Bridge (EMIB), EMIB 3.5D, and Foveros 3D. Customers can leverage advanced semiconductor packaging and chiplet libraries to quickly specify, prototype, build, test, and incorporate advanced devices into field equipment. Our advanced packaging technologies make the latest military technology available in advanced system-level packaging for programs like SHIP, and are essential for applications such as autonomous systems and secure communications, providing the performance and security required for mission-critical operations. - Expanding USG partnership with Secure Enclave and new DIB customers
Last year, Intel was awarded the Secure Enclave (SE) program, which is built on Intel’s programmatic engagement across strategic USG defense programs, including SHIP and RAMP-C. The SE program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.
Earlier this year, Intel Foundry announced the onboarding of two new DIB customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the RAMP-C efforts. With their integration, more DIB customers can take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing.
Intel Foundry is Ready to Serve
Intel Foundry is equipped and prepared to meet the diverse needs of government applications. With its cutting-edge Intel 18A process technology, advanced packaging solutions, and secure manufacturing capabilities, Intel Foundry is positioned to deliver high-performance, reliable, and secure semiconductor solutions. By leveraging State-of-the-art (SOTA) technologies and fostering strong collaboration with USG and DoD, Intel Foundry is ready to serve as a trusted partner in advancing microelectronics for critical government sectors.
Intel Foundry Direct Connect
If you're ready to connect with aerospace, defense, and government technology leaders, don't miss our premier yearly event Intel Foundry Direct Connect, on April 29, 2025, in San Jose, CA. Join customers, defense industry technologists, and our USMAG (U.S. Military, Aerospace, and Government) alliance ecosystem partners to discover how our process technology, advanced packaging, and testing can benefit your designs. Our CEO, Lip-Bu Tan, will kick off the event at 9 a.m. PDT. Register today and seize this opportunity to gain insights into the next era of systems foundry design and manufacturing.
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