Intel Foundry

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Intel Foundry
Engage with Intel Foundry and its technical and strategy experts

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How Intel Foundry Packaging Technologies Redefine AI and HPC Scalability Limits at ECTC 2026

AI and HPC systems are pushing packaging technologies to their limits. At ECTC 2026, Intel Foundry engineers and collaborators shared research on how current EMIB-T, developing co-packaged optics, and...
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Advancing Heterogeneous Integration Through Industry Roadmap Improvements

In a perspective paper published in Nature Reviews Electrical Engineering, Intel researchers along w...
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Semiconductor Innovation: Future Engineers Will Build the Smallest Devices for the Greatest Impact

The future of technology is being shaped not just by devices, but by engineers who design them. In h...
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Precision Detection: How an AI-Driven Cobot Decreases Inspection Time in High Volume Manufacturing

To improve the routine inspection of interface test adapter (ITA) pins and connectors, Intel Foundry...
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The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology

The future of US defense capability hinges on speed. James S. B. Chew, Vice President and General Ma...
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Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology

Intel Foundry engineers have demonstrated the world's first complete GaN chiplet technology based on...
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Intel Foundry Modernizes Next-Gen Microelectronics for Aerospace, Defense, and Government Systems

ADG agencies need security-enhanced, agile microelectronics to replace aging systems. With its secur...
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Intel Foundry and Partners Showcase Defense-Ready Semiconductor Technologies at GOMACTech 2026

The collective research from Intel, Intel Foundry, and our ecosystem partners at GOMACTech 2026 demo...
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Intel Foundry’s Advanced Packaging Innovations Lead the Industry in Scaling Past Reticle Limits

Semiconductor customers are demanding larger packaged products that are outgrowing the physical limi...
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Systems of Chips: Exploring the Evolving Future of Chiplet Design Capabilities

A key point emerged at Chiplet Summit 2026: Leading foundries are expanding beyond pure wafer fabric...
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Delivering Technologies to Power the AI Era: Intel Foundry at SPIE ALP 2026

At SPIE ALP 2026, Intel Foundry and ecosystem partners showcased how we’re advancing semiconductor m...
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Intel Foundry Advances Chip Power Delivery with Next-Generation Capacitor Technology

Intel and Intel Foundry researchers have demonstrated a breakthrough in metal-insulator-metal (MIM) ...
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How Intel Foundry's Advanced Silicon Technologies Accelerate AI and HPC Workloads

AI and HPC workloads present unique challenges in power consumption. Intel Foundry’s portfolio of ad...
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Intel Foundry’s System Level Testing Catches Marginal Chip Defects Missed by Traditional Methods

Intel Foundry's system level testing (SLT) catches marginal chip defects that traditional testing me...
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From Reactive to Prescriptive: Intel Foundry's AI-Powered Robot Dog Transforms Factory Inspections

Chip the robot dog inspector is just one example of how Intel Foundry uses AI, robotics, and IoT to ...
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