Intel Foundry

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Intel Foundry
Engage with Intel Foundry and its technical and strategy experts

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Intel Foundry Research Simplifies Heat Spreader Assembly to Enable Extra-Large Advanced Packages

Intel Foundry engineers researched a new disaggregated approach that separates complex heat spreaders into simpler parts, making advanced chip packaging more cost effective and easier to manufacture.
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Turbo Cells: A High-Speed Intro to Intel Foundry’s Newest Feature for the Intel 14A Family

Designers face a difficult tradeoff between high performance and low power, but what if you can have...
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Intel Foundry’s Advanced Packaging Enables Next-Gen Technologies and Capacity

At the recent International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2025, ...
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Intel Foundry Research Shows How New Bonding Technology Powers AI Chips with Precision

Intel Foundry researchers have developed an innovative thermal control technology that addresses the...
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Direct Connect Asia Offers Intimate Setting for Understanding Customers’ Systems Foundry Needs

In every region of the world, there are companies ready to benefit from the full-stack solutions ena...
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Ecosystem Ready: Intel Foundry and Partners Unlock Innovation for Customers

No customer design should ever be gated by ecosystem readiness. That’s the mission of the Intel Foun...
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How Intel Foundry Builds Reliable Global Technology Supply Chains

Intel Foundry offers the needed foundational intellectual property (IP), tools, and system technolog...
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Reflections on Intel Foundry Direct Connect 2025

April 29th provided an opportunity to share our accomplishments over this past year at Direct Connec...
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Intel Foundry is Paving the Way Towards the Trillion Transistor Chip

At IEDM 2024, Intel Foundry Technology Research published seven papers giving insight into our view ...
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Advancing the Open Chiplet Ecosystem with UCIe 2.0

With more than 130 member companies who are leading suppliers and consumers of chiplet-based archite...
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Five Ways Intel is Leading America’s Semiconductor Comeback

Here are five ways that Intel is leading America’s semiconductor comeback by partnering with the US ...
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Intel Delivers Leading-Edge Foundry Node with Intel 3 Technology; on Path Back to Process Leadership

Today we are thrilled to share details of the Intel 3 process node, which is our ultimate FinFET-bas...
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